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Axiom 32GB DDR4-3200 SODIMM for HP- 13L73AA, 141H8AAFor Mini PC, Notebook, All-in-One PC, Workstation32 GBDDR4-3200/PC4-25600 DDR4 S… 13L73AA-AX

$106.40

Axiom 32GB DDR4-3200 SODIMM for HP- 13L73AA, 141H8AA
SoDIMM 32 GB of memory to maintain symmetry with processor and hard drive and bring out the ultimate computing experience.
No matter how heavy and numerous the applications that you are using, 3200 MHz memory speed with CL22 latency will run them smoothly.
260-pin-pin DDR4 SDRAM operates at an effective bus speed with minimal power consumption and as a result, you get optimal computer performance with an improved memory heat dissipation.
Top grade chips and components – Each Axiom memory module is manufactured to meet or exceed OEM specifications..
Fully tested – All memory modules that leave our warehouse are fully tested to guarantee quality and reliability..
Guaranteed compatibility – Axiom guarantees that each system specific module will work with its corresponding OEM computer..
Lifetime warranty – Once you purchase an Axiom memory module, you never need to worry about failure because all Axiom memory modules come with a lifetime warranty..
Free unlimited tech support – Speak to a real human being and not a computer message. Tech support is available to every one of our customers via phone or email..

SKU: 13L73AA-AX Category:

Description

Axiom 32GB DDR4-3200 SODIMM for HP- 13L73AA, 141H8AA

Axiom’s DDR4 Modules use the latest evolutionary DRAM design, provides improved speed, power management and reliability. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.

High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.

DDR4 Features:

  • 100% Increase in speed – Faster Data Rate equates to more responsive application loads on data-intensive programs.
  • 300% increase in component densities – Equals larger modules for next-generation performance demands.
  • 20% decrease in power consumption – Less power consumed means less wasted resources to cool systems and reserves battery program for mobile devices.
  • Provides greater reliability, availability and serviceability (RAS) in enterprise applications – Complete integrity and fault tolerance for longer periods without system failure.
  • Improved data signal.
  • Additional information

    Weight 0.01 lbs
    Dimensions 1.18 × 2.74 × 0.15 in