Summit® X670 series switches are high density, low latency 10 Gigabit Ethernet stackable switches with optional 10 Gigabit Ethernet uplinks.
The Summit X670 series switches are purpose-built top-of-rack switches designed to support emerging 10 Gigabit Ethernet-enabled servers in enterprise and cloud data centers. Summit X670 helps optimize new server deployments with its optional, future-proofing 40 GbE uplink for 10 GbE-based high-performance servers to start the transition to the new virtualized environment.
The Summit X670 series is available in two models: Summit X670V and Summit X670. Summit X670V provides high density for 10 Gigabit Ethernet switching in a small 1RU form factor. The switch supports up to 64 ports in one system and 448 ports in a stacked system using high-speed SummitStack-V320, which provides 160 Gbps and 320 Gbps throughput and distributed forwarding. The Summit X670 model provides up to 48 ports in one system and up to 352 ports in a stacked system using SummitStack-V longer distance (up to 40 km with 10GBASE-ER SFP+) stacking technology.
The Summit X670 series provides high density Layer 2/3 switching with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast routing to enable enterprise aggregation and core backbone deployment in AC-powered and DC-powered environments.
Summit X670 series include the ExtremeXOS modular operating system. The high availability ExtremeXOS operating system provides simplicity and ease of operation through the use of one OS everywhere in the network.
- Top-of-rack switch for servers in enterprise and cloud data centers
- High-performance 10 GbE core switch for a small network
- High-performance 10 GbE aggregation switch in a traditional three-tiered network
- Interconnect switch providing low latency connections for High Performance Cluster Computing (HPCC)
Benefits & Features
The Summit X670 series provides intelligent switching and routing with exceptional high-performance stacking technology for next generation enterprise and cloud data centers—with dedicated 40 Gigabit Ethernet uplink capabilities powered by the ExtremeXOS modular OS.
The Summit X670 model offers 48-port 10 Gigabit Ethernet non-blocking switching with 10GBASE-X SFP+ interfaces. Summit X670 is capable of Layer 2 and Layer 3 forwarding at up to 714 million packets per second forwarding rate in a small 1RU form factor, enabling next-generation high-performance server deployment in data centers. Both models support SummitStack-V high-speed, longer distance stacking.
The Summit X670V model can support an additional four QSFP+ ports of 40 GbE with the optional VIM4-40G4X module. With this option, you can maximize the number of interfaces for servers up to 48 ports while using the dedicated four-port 40 GbE module for uplink connectivity. Each 40 Gigabit Ethernet port can be independently configured as 40 Gigabit Ethernet or 4 x 10 Gigabit Ethernet; thus with the VIM4-40G4X module, Summit X670V can support up to 64 ports of 10 Gigabit Ethernet in a 1RU form factor and is capable of Layer 2 and Layer 3 forwarding at up to 952 million packets per second forwarding rate. This configuration provides 3:1 oversubscription from front ports to uplink ports.
Summit X670V with VIM4-40G4X provides high speed stacking running at 160Gbps through the SummitStack-V160 technology and 320Gbps through the SummitStack-V320 technology. SummitStack-V160 can be enabled on two 40 Gigabit Ethernet QSFP+ ports on the VIM4-40G4X. SummitStack-V160 is compatible with SummitStack-V80 which is available for Summit X460 and Summit X480 series switches. SummitStack-V320 is enabled using all four 40 Gigabit Ethernet QSFP+ ports on the VIM4-40GX module.
Summit X670 provides sub-microsecond latency and supports cut-through switching to help optimize the high frequency trading application as well as latency sensitive cluster computing.